The objective of this project was to develop and evaluate numerical methods to predict the current density distribution and consequently the deposition of reacting species in electrochemical systems of various natures and industrial relevance.
The obtained results yield essential design tools to many branches of the electrochemical industry: plating industry (contacts, PCB's, Smart cards, spot plating, strip and wire plating, ...) where it is a major problem to obtain uniformly deposited layers on well defined places, etching industry, anodising industry, electrochemical machining industry (e.g. electrochemical cutting) and the electrochemical recovery industry.
Effective start/end date1/01/9731/12/00

    Flemish discipline codes

  • Electrical and electronic engineering
  • Materials engineering

    Research areas

  • stroomdichtheidsverdelingen, laagdikteverdelingen, electricty, elektrochemie, numerieke simulatie

ID: 2786147