1. 2019
  2. Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications

    Vandooren, A., Wu, Z., Khaled, A., Franco, J., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Rassoul, N., Matagne, P., Debruyn, H., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Radisic, D. & 16 others, Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B. Y., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Ryckaert, J., Collaert, N. & Mocuta, D., 1 Jun 2019, 2019 Symposium on VLSI Technology, VLSI Technology 2019 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. T56-T57 8776490. (Digest of Technical Papers - Symposium on VLSI Technology; vol. 2019-June).

    Research output: Chapter in Book/Report/Conference proceedingConference paper

  3. Key challenges and opportunities for 3D sequential integration

    Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Li, W., Rosseel, E., Hikkavyy, A., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N. & 5 others, Boemmels, J., De Heyn, V., Mocuta, D., Ryckaert, J. & Collaert, N., 11 Feb 2019, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018. Institute of Electrical and Electronics Engineers Inc., 8640203. (2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018).

    Research output: Chapter in Book/Report/Conference proceedingConference paper

  4. First Demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers

    Vandooren, A., Franco, J., Wu, Z., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Deshpande, V., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W. & 13 others, Hikavyy, A., Mannaert, G., Chan, B. T., Ritzenthaler, R., Mitard, J., Ragnarsson, L., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Mocuta, D., Ryckaert, J. & Collaert, N., 16 Jan 2019, 2018 IEEE International Electron Devices Meeting, IEDM 2018. Institute of Electrical and Electronics Engineers Inc., p. 7.1.1-7.1.4 8614654. (Technical Digest - International Electron Devices Meeting, IEDM; vol. 2018-December).

    Research output: Chapter in Book/Report/Conference proceedingConference paper

  5. 2018
  6. 3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability

    Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F. M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T. & 14 others, Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B. Y., Waldron, N., De Heyn, V., Mocuta, D. & Collaert, N., Nov 2018, In : IEEE Transactions on Electron Devices. 65, 11, p. 5165-5171 7 p., 8487028.

    Research output: Contribution to journalArticle

  7. Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

    Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Walke, A., Deshpande, V., Rosseel, E., Hikavyy, A., Li, W., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E. & 5 others, Zheng, T., Waldron, N., De Heyn, V., Mocuta, D. & Collaert, N., 27 Jun 2018, ICICDT 2018 - International Conference on IC Design and Technology, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 145-148 4 p. (ICICDT 2018 - International Conference on IC Design and Technology, Proceedings).

    Research output: Chapter in Book/Report/Conference proceedingConference paper

  8. 2017
  9. Decentralized Multi-Robot Formation Control with Communication Delay and Asynchronous Clock

    Peng, L., Guan, F., Perneel, L., Fayyad-Kazan, H. & Timmerman, M., 5 Apr 2017, (Accepted/In press) In : Journal of Intelligent & Robotic Systems.

    Research output: Contribution to journalArticle

  10. A Design That Incorporates Adaptive Reservation into Mixed-Criticality Systems

    Guan, F., Peng, L., Perneel, L., Fayyad-Kazan, H. & Timmerman, M., 1 Jan 2017, In : Scientific Programming. 2017, 20 p., 3403685.

    Research output: Contribution to journalArticle

  11. 2016
  12. EmSBot: A modular framework supporting the development of swarm robotics applications

    Peng, L., Guan, F., Perneel, L. & Timmerman, M., 12 Nov 2016, In : International Journal of Advanced Robotic Systems. 13, 6, p. 1-15 15 p.

    Research output: Contribution to journalArticle

  13. EmSBoT: A lightweight modular software framework for networked robotic systems

    Peng, L., Guan, F., Perneel, L., Fayyad-Kazan, H. & Timmerman, M., 5 Sep 2016, IEEE. p. 216-221 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference paper

  14. Behaviour and Performance Comparison between FreeRTOS and uC/OS-III

    Peng, L., Guan, F., Perneel, L. & Timmerman, M., 1 Jul 2016, In : International Journal of Embedded Systems. 8, 4, p. 300-312 13 p.

    Research output: Contribution to journalArticle

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