1. 2015
  2. The Limitation and Optimization of Bottom-Up Growth Mode in Through Silicon Via Electroplating

    Yang, L., Radisic, A., Deconinck, J. & Vereeeken, P., 2015, In : Journal of the Electrochemical Society. 162, 14, p. D599-D604 6 p.

    Research output: Contribution to journalArticle

  3. 2013
  4. Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism

    Yang, L., Radisic, A., Deconinck, J. & Vereecken, P., 25 Jun 2013, In : Journal of the Electrochemical Society. 12, 160, p. 3051-3056 6 p.

    Research output: Contribution to journalArticle

  5. Wafer-Scale Cu Plating Uniformity on Thin Cu Seed Layers

    Yang, L., Atanasova, T., Radisic, A., Deconinck, J., West, A. & Vereecken, P., 26 Apr 2013, In : Electrochimica Acta. 104, p. 242-248 7 p.

    Research output: Contribution to journalArticle

  6. Role of oxygen and cuprous ions in copper electroplating

    Yang, L., Marchal, W., Radisic, A., Deconinck, J. & Vereecken, P., 10 Mar 2013, 22nd Materials for advanced metallization conference. (22nd Materials for advanced metallization conference).

    Research output: Chapter in Book/Report/Conference proceedingMeeting abstract (Book)

  7. Bottom-up filling of through-silicon vias due to suppressor desorption

    Yang, L., Radisic, A., Deconinck, J. & Vereecken, P., 2013, 224th ECS Meeting.

    Research output: Chapter in Book/Report/Conference proceedingMeeting abstract (Book)

  8. Copper Plating Uniformity On Resistive Substrate With Segmented Anode

    Yang, L., Radisic, A., Deconinck, J. & Vereecken, P., 2013, 224th ECS Meeting.

    Research output: Chapter in Book/Report/Conference proceedingMeeting abstract (Book)

  9. 2012
  10. Multi-scale modeling of direct copper plating on resistive non-copper substrates

    Yang, L., Radisic, A., Nagar, M., Deconinck, J., Leunissen, L., Vereecken, P. & West, A., 7 Oct 2012, 222nd Meeting of ECS. (222nd Meeting of ECS).

    Research output: Chapter in Book/Report/Conference proceedingMeeting abstract (Book)

  11. Multi-scale modeling of direct copper plating on resistive non-copper substrates

    Yang, L., Radisic, A., Nagar, M., Deconinck, J., Vereecken, P. & West, A., 2 Jul 2012, In : Electrochimica Acta. 78, p. 524-531 8 p.

    Research output: Contribution to journalArticle

ID: 107770